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KVR24N17D8/16
ValueRAM's KVR24N17D8/16 is a 2G x 64-bit (16GB) DDR4-2400 CL17 SDRAM (Synchronous DRAM), 2Rx8, memory module, based on sixteen 1G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2400 timing of 17-17-17 at 1.2V. Each 288-pin DIMM uses gold contact fingers.


KVR26N19D8/16
ValueRAM's KVR26N19D8/16 is a 2G x 64-bit (16GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM), 2Rx8, memory module, based on sixteen 1G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers.

RM389.00

KVR24N17S8/8
ValueRAM's KVR24N17S8/8 is a 1G x 64-bit (8GB) DDR4-2400 CL17 SDRAM (Synchronous DRAM), 1Rx8, memory module, based on eight 1G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2400 timing of 17-17-17 at 1.2V. Each 288-pin DIMM uses gold contact fingers.

KVR26N19S8/8
ValueRAM's KVR26N19S8/8 is a 1G x 64-bit (8GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM), 1Rx8, memory module, based on eight 1G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers.

RM207.00

KVR24N17S6/4
ValueRAM's KVR24N17S6/4 is a 512M x 64-bit (4GB) DDR4-2400 CL17 SDRAM (Synchronous DRAM), 1Rx16, memory module, based on four 512M x 16-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2400 timing of 17-17-17 at 1.2V. Each 288-pin DIMM uses gold contact fingers.

KVR26N19S6/4
ValueRAM's KVR26N19S6/4 is a 512M x 64-bit (4GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM), 1Rx16, memory module, based on four 512M x 16-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers.

RM119.00
  •  Power Supply: VDD=1.2V Typical
  • VDDQ = 1.2V Typical
  • VPP - 2.5V Typical
  • VDDSPD=2.2V to 3.6V
  • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
  • Low-power auto self refresh (LPASR)
  • Data bus inversion (DBI) for data bus
  • On-die VREFDQ generation and calibration
  • Dual-rank
  • On-board I2 serial presence-detect (SPD) EEPROM
  • 16 internal banks; 4 groups of 4 banks each
  • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
  • Selectable BC4 or BL8 on-the-fly (OTF)
  • Fly-by topology
  • Terminated control command and address bus
  • PCB: Height 1.18” (30.00mm)
  • RoHS Compliant and Halogen-Free
RM369.00
  • Power Supply: VDD=1.2V Typical
  • VDDQ = 1.2V Typical
  • VPP - 2.5V Typical
  • VDDSPD=2.2V to 3.6V
  • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
  • Low-power auto self refresh (LPASR)
  • Data bus inversion (DBI) for data bus
  • On-die VREFDQ generation and calibration
  • Single-rank
  • On-board I2 serial presence-detect (SPD) EEPROM
  • 16 internal banks; 4 groups of 4 banks each
  • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
  • Selectable BC4 or BL8 on-the-fly (OTF)
  • Fly-by topology
  • Terminated control command and address bus
  • PCB: Height 1.18” (30.00mm)
  • RoHS Compliant and Halogen-Free
RM195.00