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  • Incredible PCIe Gen 4x4 NVMe performance
  • Low-profile graphene aluminium heat spreader
  • Slim M.2 2280 form factor
  • High capacities of up to 4TB2
  • PS5™ ready
RM384.00
  • Limited Year of the Rabbit Zodiac 64GB Pendrive
  • Metal USB drive with styling rubber casing
  • Cynlinder acrylic display package
RM99.00
  • Powerful SODIMM performance
  • Plug N Play automatic overclocking functionality1
  • Intel® XMP-ready and XMP Certified
  • Ready for AMD Ryzen™
  • Higher performance with low power consumption
  • Slim form factor, sleek design
RM185.00
  • Gen 4x4 NVMe PCIe performance
  • Perfect for thin laptops and small-form-factor PCs
  •  Up to 3,000MB/s read, 1,300MB/s write
  • Up to 3,000MB/s read, 1,300MB/s write
RM120.00
  • Faster speeds — Class 10 UHS-I speeds up to 100MB/s.
  • Optimized for use with Android devices — improved performance when used with an Android smartphone or tablet.
  • Multiple capacities — Up to 512GB1 to store all your memorable photos and videos.
  • Durable — for your peace of mind, The card has been extensively tested and proven to be waterproof, temperature proof, shock and vibration proof and X-Ray proof. 
RM18.00
  • Cost-efficient, high-performance DDR4 upgrade
  • Speeds up to 3,733MHz and kit capacity up to 128GB
  • Intel® XMP-ready and XMP Certified
  • Ready for AMD Ryzen™
  • Low-profile heat spreader design
  • Plug N Play functionality at 2666MHz1
RM200.00
  • Cost-efficient, high-performance DDR4 upgrade
  • Speeds up to 3,733MHz and kit capacity up to 128GB
  • Intel® XMP-ready and XMP Certified
  • Ready for AMD Ryzen™
  • Low-profile heat spreader design
  • Plug N Play functionality at 2666MHz1
RM119.00

• Power Supply: VDD = 1.2V Typical • VDDQ = 1.2V Typical • VPP = 2.5V Typical • VDDSPD = 2.2V to 3.6V • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals • Low-power auto self refresh (LPASR) • Data bus inversion (DBI) for data bus • On-die VREFDQ generation and calibration • Single-rank • On-board I2 serial presence-detect (SPD) EEPROM • 16 internal banks; 4 groups of 4 banks each • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) • Selectable BC4 or BL8 on-the-fly (OTF) • Fly-by topology • Terminated control command and address bus • PCB: Height 1.23” (31.25mm) • RoHS Compliant and Halogen-Free

RM107.00

• Power Supply: VDD = 1.2V Typical • VDDQ = 1.2V Typical • VPP = 2.5V Typical • VDDSPD = 2.2V to 3.6V • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals • Low-power auto self refresh (LPASR) • Data bus inversion (DBI) for data bus • On-die VREFDQ generation and calibration • Single-rank • On-board I2 serial presence-detect (SPD) EEPROM • 8 internal banks; 2 groups of 4 banks each • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) • Selectable BC4 or BL8 on-the-fly (OTF) • Fly-by topology • Terminated control command and address bus • PCB: Height 1.23” (31.25mm) • RoHS Compliant and Halogen-Free

RM83.00
  • Greater performance starting at 4800MT/s
  • Improved stability for overclocking
  • Increased efficiency
  • Intel® XMP 3.0 Certified
  • AMD EXPO™ Certified
  • Qualified by the world’s leading motherboard manufacturers1
  • Plug N Play at 4800MT/s{Footnote.N64683}}
  • Low-profile heat spreader design
RM183.00
  • Incredible PCIe Gen 4x4 NVMe performance
  • Low-profile graphene aluminium heat spreader
  • Slim M.2 2280 form factor
  • High capacities of up to 4TB2
  • PS5™ ready
RM311.00
  • PCIe 4.0 NVMe high-performance
  • Upgrade with full capacities up to 4096GB2
  • Compact M.2 2280 form factor
  • Low profile graphene aluminum heat spreader
RM269.00

• Power Supply: VDD = 1.2V Typical • VDDQ = 1.2V Typical • VPP = 2.5V Typical • VDDSPD = 2.2V to 3.6V • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals • Low-power auto self refresh (LPASR) • Data bus inversion (DBI) for data bus • On-die VREFDQ generation and calibration • Single-rank • On-board I2 serial presence-detect (SPD) EEPROM • 16 internal banks; 4 groups of 4 banks each • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) • Selectable BC4 or BL8 on-the-fly (OTF) • Fly-by topology • Terminated control command and address bus • PCB: Height 1.23” (31.25mm) • RoHS Compliant and Halogen-Free

RM190.00

• Power Supply: VDD = 1.1V Typical • VDDQ = 1.1V Typical • VPP = 1.8V Typical • VDDSPD = 1.8V to 2.0V • On-Die ECC • PCB: Height 1.18” (30.00mm) • RoHS Compliant and Halogen-Free

RM176.00

• Power Supply: VDD = 1.2V Typical • VDDQ = 1.2V Typical • VPP = 2.5V Typical • VDDSPD = 2.2V to 3.6V • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals • Low-power auto self refresh (LPASR) • Data bus inversion (DBI) for data bus • On-die VREFDQ generation and calibration • Single-rank • On-board I2 serial presence-detect (SPD) EEPROM • 16 internal banks; 4 groups of 4 banks each • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) • Selectable BC4 or BL8 on-the-fly (OTF) • Fly-by topology • Terminated control command and address bus • PCB: Height 1.18” (30.00mm) • RoHS Compliant and Halogen-Free

RM190.00
  • Mighty DDR5 SODIMM performance
  • Plug N Play automatic overclocking functionality1
  • Intel® XMP 3.0 Certified
  • Lower power consumption, increased efficiency
  • Improved stability with on-die ECC
RM556.00
  • Mighty DDR5 SODIMM performance
  • Plug N Play automatic overclocking functionality1
  • Intel® XMP 3.0 Certified
  • Lower power consumption, increased efficiency
  • Improved stability with on-die ECC
RM297.00
  • Remarkable performance
  • Features the latest 3D TLC NAND technology
  • Supports a full security suite (TCG Opal, AES 256-bit, eDrive)
  • Available in range of full capacities
RM123.00
  • Powerful SODIMM performance
  • Plug N Play automatic overclocking functionality1
  • Intel® XMP-ready and XMP Certified
  • Ready for AMD Ryzen™
  • Higher performance with low power consumption
  • Slim form factor, sleek design
RM117.00
  • Powerful SODIMM performance
  • Plug N Play automatic overclocking functionality1
  • Intel® XMP-ready and XMP Certified
  • Ready for AMD Ryzen™
  • Higher performance with low power consumption
  • Slim form factor, sleek design
RM195.00
  • Powerful SODIMM performance
  • Plug N Play automatic overclocking functionality1
  • Intel® XMP-ready and XMP Certified
  • Ready for AMD Ryzen™
  • Higher performance with low power consumption
  • Slim form factor, sleek design
RM379.00
  • Powerful SODIMM performance
  • Plug N Play automatic overclocking functionality1
  • Intel® XMP-ready and XMP Certified
  • Ready for AMD Ryzen™
  • Higher performance with low power consumption
  • Slim form factor, sleek design
RM379.00

KVR26N19D8/16
ValueRAM's KVR26N19D8/16 is a 2G x 64-bit (16GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM), 2Rx8, memory module, based on sixteen 1G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers.

RM299.00

KVR26N19S8/8
ValueRAM's KVR26N19S8/8 is a 1G x 64-bit (8GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM), 1Rx8, memory module, based on eight 1G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers.

RM107.00

KVR26N19S6/4
ValueRAM's KVR26N19S6/4 is a 512M x 64-bit (4GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM), 1Rx16, memory module, based on four 512M x 16-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers.

RM83.00
  • Powerful SODIMM performance
  • Plug N Play automatic overclocking functionality1
  • Intel® XMP-ready and XMP Certified
  • Ready for AMD Ryzen™
  • Higher performance with low power consumption
  • Slim form factor, sleek design
RM109.00
  • Mighty DDR5 SODIMM performance
  • Plug N Play automatic overclocking functionality1
  • Intel® XMP 3.0 Certified
  • Lower power consumption, increased efficiency
  • Improved stability with on-die ECC
RM219.00
  • Fast start-up, loading and file transfers
  • More reliable and durable than a hard drive
  • Multiple capacities with space for applications or a hard drive replacement
RM245.00
  • Fast start-up, loading and file transfers
  • More reliable and durable than a hard drive
  • Multiple capacities with space for applications or a hard drive replacement
RM112.00
  • Fast start-up, loading and file transfers
  • More reliable and durable than a hard drive
  • Multiple capacities with space for applications or a hard drive replacement
RM145.00
  •  Power Supply: VDD=1.2V Typical
  • VDDQ = 1.2V Typical
  • VPP - 2.5V Typical
  • VDDSPD=2.2V to 3.6V
  • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
  • Low-power auto self refresh (LPASR)
  • Data bus inversion (DBI) for data bus
  • On-die VREFDQ generation and calibration
  • Dual-rank
  • On-board I2 serial presence-detect (SPD) EEPROM
  • 16 internal banks; 4 groups of 4 banks each
  • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
  • Selectable BC4 or BL8 on-the-fly (OTF)
  • Fly-by topology
  • Terminated control command and address bus
  • PCB: Height 1.18” (30.00mm)
  • RoHS Compliant and Halogen-Free
RM155.00
  • Power Supply: VDD=1.2V Typical
  • VDDQ = 1.2V Typical
  • VPP - 2.5V Typical
  • VDDSPD=2.2V to 3.6V
  • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
  • Low-power auto self refresh (LPASR)
  • Data bus inversion (DBI) for data bus
  • On-die VREFDQ generation and calibration
  • Single-rank
  • On-board I2 serial presence-detect (SPD) EEPROM
  • 16 internal banks; 4 groups of 4 banks each
  • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
  • Selectable BC4 or BL8 on-the-fly (OTF)
  • Fly-by topology
  • Terminated control command and address bus
  • PCB: Height 1.18” (30.00mm)
  • RoHS Compliant and Halogen-Free
RM107.00
  • DUAL INTERFACE ACCOMMODATES USB TYPE-A AND USB TYPE-C PORTS
  • ADDITIONAL STORAGE FOR NEWER DEVICES WITH LIMITED EXPANSION PORTS
  • FAST DATA TRANSFER SPEEDS UP TO 100MB/s READ AND 15MB/s WRITE
RM119.00
  • DUAL INTERFACE ACCOMMODATES USB TYPE-A AND USB TYPE-C PORTS
  • ADDITIONAL STORAGE FOR NEWER DEVICES WITH LIMITED EXPANSION PORTS
  • FAST DATA TRANSFER SPEEDS UP TO 100MB/s READ AND 15MB/s WRITE
RM69.00
  • DUAL INTERFACE ACCOMMODATES USB TYPE-A AND USB TYPE-C PORTS
  • ADDITIONAL STORAGE FOR NEWER DEVICES WITH LIMITED EXPANSION PORTS
  • FAST DATA TRANSFER SPEEDS UP TO 100MB/s READ AND 15MB/s WRITE
RM45.00
  • Fast start-up, loading and file transfers
  • More reliable and durable than a hard drive
  • Multiple capacities with space for applications or a hard drive replacement
RM79.00