• Faster speeds — Class 10 UHS-I speeds up to 100MB/s.
• Optimized for use with Android devices — improved performance when used with an Android smartphone or tablet.
• Multiple capacities — Up to 512GB1 to store all your memorable photos and videos.
• Durable — for your peace of mind, The card has been extensively tested and proven to be waterproof, temperature proof, shock and vibration proof and X-Ray proof. 

• Limited Year of the Tiger Zodiac 64GB Pendrive
• Metal USB drive with styling rubber casing
• Beer can acrylic display package

• Cost-efficient, high-performance DDR4 upgrade
• Speeds up to 3,733MHz and kit capacity up to 128GB
• Intel® XMP-ready and XMP Certified
• Ready for AMD Ryzen™
• Low-profile heat spreader design
• Plug N Play functionality at 2666MHz¹

• Cost-efficient, high-performance DDR4 upgrade
• Speeds up to 3,733MHz and kit capacity up to 128GB
• Intel® XMP-ready and XMP Certified
• Ready for AMD Ryzen™
• Low-profile heat spreader design
• Plug N Play functionality at 2666MHz¹

• Incredible PCIe Gen 4x4 NVMe performance
• Low-profile graphene aluminium heat spreader
• Slim M.2 2280 form factor
• High capacities of up to 4TB²
• PS5™ ready

• PCIe 4.0 NVMe high-performance
• Upgrade with full capacities up to 4096GB²
• Compact M.2 2280 form factor
• Low profile graphene aluminum heat spreader

• Powerful SODIMM performance
• Plug N Play automatic overclocking functionality¹
• Intel® XMP-ready and XMP Certified
• Ready for AMD Ryzen™
• Higher performance with low power consumption
• Slim form factor, sleek design

• Powerful SODIMM performance
• Plug N Play automatic overclocking functionality¹
• Intel® XMP-ready and XMP Certified
• Ready for AMD Ryzen™
• Higher performance with low power consumption
• Slim form factor, sleek design

• Remarkable performance
• Features the latest 3D TLC NAND technology
• Supports a full security suite (TCG Opal, AES 256-bit, eDrive)
• Available in range of full capacities

• Powerful SODIMM performance
• Plug N Play automatic overclocking functionality¹
• Intel® XMP-ready and XMP Certified
• Ready for AMD Ryzen™
• Higher performance with low power consumption
• Slim form factor, sleek design

• Powerful SODIMM performance
• Plug N Play automatic overclocking functionality¹
• Intel® XMP-ready and XMP Certified
• Ready for AMD Ryzen™
• Higher performance with low power consumption
• Slim form factor, sleek design

• Powerful SODIMM performance
• Plug N Play automatic overclocking functionality¹
• Intel® XMP-ready and XMP Certified
• Ready for AMD Ryzen™
• Higher performance with low power consumption
• Slim form factor, sleek design

• Powerful SODIMM performance
• Plug N Play automatic overclocking functionality¹
• Intel® XMP-ready and XMP Certified
• Ready for AMD Ryzen™
• Higher performance with low power consumption
• Slim form factor, sleek design

KVR26N19D8/16
ValueRAM's KVR26N19D8/16 is a 2G x 64-bit (16GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM), 2Rx8, memory module, based on sixteen 1G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers.

KVR26N19S8/8
ValueRAM's KVR26N19S8/8 is a 1G x 64-bit (8GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM), 1Rx8, memory module, based on eight 1G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers.

KVR26N19S6/4
ValueRAM's KVR26N19S6/4 is a 512M x 64-bit (4GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM), 1Rx16, memory module, based on four 512M x 16-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers.

• Fast start-up, loading and file transfers
• More reliable and durable than a hard drive
• Multiple capacities with space for applications or a hard drive replacement

• Faster speeds — Class 10 UHS-I speeds up to 100MB/s.
• Optimized for use with Android devices — improved performance when used with an Android smartphone or tablet.
• Multiple capacities — Up to 512GB1 to store all your memorable photos and videos.
• Durable — for your peace of mind, The card has been extensively tested and proven to be waterproof, temperature proof, shock and vibration proof and X-Ray proof. 

• Fast satrtup, loading and file transfers
• More reliable and durable than a hard drive
• Multiple capacities with space for applications or a hard drive replacement

• Powerful SODIMM performance
• Plug N Play automatic overclocking functionality¹
• Intel® XMP-ready and XMP Certified
• Ready for AMD Ryzen™
• Higher performance with low power consumption
• Slim form factor, sleek design

• Powerful SODIMM performance
• Plug N Play automatic overclocking functionality¹
• Intel® XMP-ready and XMP Certified
• Ready for AMD Ryzen™
• Higher performance with low power consumption
• Slim form factor, sleek design

• Powerful SODIMM performance
• Plug N Play automatic overclocking functionality¹
• Intel® XMP-ready and XMP Certified
• Ready for AMD Ryzen™
• Higher performance with low power consumption
• Slim form factor, sleek design

• Fast start-up, loading and file transfers
• More reliable and durable than a hard drive
• Multiple capacities with space for applications or a hard drive replacement

• Fast start-up, loading and file transfers
• More reliable and durable than a hard drive
• Multiple capacities with space for applications or a hard drive replacement

• Fast start-up, loading and file transfers
• More reliable and durable than a hard drive
• Multiple capacities with space for applications or a hard drive replacement

• STYLISH AND FUNCTIONAL CAPLESS DESIGN
• USB3.0 PERFORMANCE FOR SEAMLESS DATA TRANSFER

• STYLISH AND FUNCTIONAL CAPLESS DESIGN
• USB3.0 PERFORMANCE FOR SEAMLESS DATA TRANSFER

•  Power Supply: VDD=1.2V Typical
• VDDQ = 1.2V Typical
• VPP - 2.5V Typical
• VDDSPD=2.2V to 3.6V
• Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die VREFDQ generation and calibration
• Dual-rank
• On-board I2 serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Fly-by topology
• Terminated control command and address bus
• PCB: Height 1.18” (30.00mm)
• RoHS Compliant and Halogen-Free

• Power Supply: VDD=1.2V Typical
• VDDQ = 1.2V Typical
• VPP - 2.5V Typical
• VDDSPD=2.2V to 3.6V
• Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die VREFDQ generation and calibration
• Single-rank
• On-board I2 serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Fly-by topology
• Terminated control command and address bus
• PCB: Height 1.18” (30.00mm)
• RoHS Compliant and Halogen-Free

• DUAL INTERFACE ACCOMMODATES USB TYPE-A AND USB TYPE-C PORTS
• ADDITIONAL STORAGE FOR NEWER DEVICES WITH LIMITED EXPANSION PORTS
• FAST DATA TRANSFER SPEEDS UP TO 100MB/s READ AND 15MB/s WRITE

• DUAL INTERFACE ACCOMMODATES USB TYPE-A AND USB TYPE-C PORTS
• ADDITIONAL STORAGE FOR NEWER DEVICES WITH LIMITED EXPANSION PORTS
• FAST DATA TRANSFER SPEEDS UP TO 100MB/s READ AND 15MB/s WRITE

• DUAL INTERFACE ACCOMMODATES USB TYPE-A AND USB TYPE-C PORTS
• ADDITIONAL STORAGE FOR NEWER DEVICES WITH LIMITED EXPANSION PORTS
• FAST DATA TRANSFER SPEEDS UP TO 100MB/s READ AND 15MB/s WRITE

• EXPANDED STORAGE FOR TABLETS AND SMARTPHONES WITH USB OTG SUPPORT
• QUICKLY TRANSFER AND BACK UP FILES, PHOTOS AND VIDEO TO YOUR COMPUTER AT USB3.0 SPEEDS
• EASILY SHARE FILES BETWEEN MOBILE DEVICES WITHOUT THE NEED FOR CABLES OR WI-FI
• SMALL FROM FACTOR FOR EASY PORTABILITY

• EXPANDED STORAGE FOR TABLETS AND SMARTPHONES WITH USB OTG SUPPORT
• QUICKLY TRANSFER AND BACK UP FILES, PHOTOS AND VIDEO TO YOUR COMPUTER AT USB3.0 SPEEDS
• EASILY SHARE FILES BETWEEN MOBILE DEVICES WITHOUT THE NEED FOR CABLES OR WI-FI
• SMALL FROM FACTOR FOR EASY PORTABILITY

• EXPANDED STORAGE FOR TABLETS AND SMARTPHONES WITH USB OTG SUPPORT
• QUICKLY TRANSFER AND BACK UP FILES, PHOTOS AND VIDEO TO YOUR COMPUTER AT USB3.0 SPEEDS
• EASILY SHARE FILES BETWEEN MOBILE DEVICES WITHOUT THE NEED FOR CABLES OR WI-FI
• SMALL FROM FACTOR FOR EASY PORTABILITY

• ULTRA-SMALL, CAPLESS DESIGN WITH METAL CASING
• USB 3.1 GEN 1 (USB3.0)

• ULTRA-SMALL, CAPLESS DESIGN WITH METAL CASING
• USB 3.1 GEN 1 (USB3.0)
  

• Ultra-small, capless design with metal casing
• USB 3.2 Gen 1¹
• 100MB/s read
• Part Number: DTMC3/32GB

• STYLISH AND FUNCTIONAL CAPLESS DESIGN
• USB3.0 PERFORMANCE FOR SEAMLESS DATA TRANSFER

• STYLISH AND FUNCTIONAL CAPLESS DESIGN
• USB3.0 PERFORMANCE FOR SEAMLESS DATA TRANSFER

• Compliant — with USB 3.0 specifications
• Dual compatibility — USB 3.0 connectivity; backwards compatible with USB 2.0
• Practical — cap protects the USB plug
• Fashionable — available in multiple colours by capacity: 8GB Yellow, 16GB Blue, 32GB Red, 64GB Violet, 128GB Green

• Supports Windows® 10, Windows 8.1, Windows 8, Windows 7 (SP1), Windows Vista® (SP2), Mac OS X v.10.8.x+, Linux v.2.6.x+ & Chrome OS™
• Stylish metal casing
• Sturdy loop

• Fast start-up, loading and file transfers
• More reliable and durable than a hard drive
• Multiple capacities with space for applications or a hard drive replacement

• Compliant — with USB 3.0 specifications
• Dual compatibility — USB 3.0 connectivity; backwards compatible with USB 2.0
• Practical — cap protects the USB plug
• Fashionable — available in multiple colours by capacity: 8GB Yellow, 16GB Blue, 32GB Red, 64GB Violet, 128GB Green