![Kingston FURY Impact 16GB DDR4 3200 MHz CL20 SODIMM Gaming RAM Memory For Laptop Notebook [KF432S20IB/16]](https://ato.com.my/image/ato/image/cache/defaultlazyload-420x420.jpg)
- Powerful SODIMM performance
- Plug N Play automatic overclocking functionality1
- Intel® XMP-ready and XMP Certified
- Ready for AMD Ryzen™
- Higher performance with low power consumption
- Slim form factor, sleek design
- Gen 4x4 NVMe PCIe performance
- Perfect for thin laptops and small-form-factor PCs
- Up to 3,000MB/s read, 1,300MB/s write
- Up to 3,000MB/s read, 1,300MB/s write
- Faster speeds — Class 10 UHS-I speeds up to 100MB/s.
- Optimized for use with Android devices — improved performance when used with an Android smartphone or tablet.
- Multiple capacities — Up to 512GB1 to store all your memorable photos and videos.
- Durable — for your peace of mind, The card has been extensively tested and proven to be waterproof, temperature proof, shock and vibration proof and X-Ray proof.
- Limited Year of the Tiger Zodiac 64GB Pendrive
- Metal USB drive with styling rubber casing
- Beer can acrylic display package
- Cost-efficient, high-performance DDR4 upgrade
- Speeds up to 3,733MHz and kit capacity up to 128GB
- Intel® XMP-ready and XMP Certified
- Ready for AMD Ryzen™
- Low-profile heat spreader design
- Plug N Play functionality at 2666MHz1
- Cost-efficient, high-performance DDR4 upgrade
- Speeds up to 3,733MHz and kit capacity up to 128GB
- Intel® XMP-ready and XMP Certified
- Ready for AMD Ryzen™
- Low-profile heat spreader design
- Plug N Play functionality at 2666MHz1
• Power Supply: VDD = 1.2V Typical • VDDQ = 1.2V Typical • VPP = 2.5V Typical • VDDSPD = 2.2V to 3.6V • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals • Low-power auto self refresh (LPASR) • Data bus inversion (DBI) for data bus • On-die VREFDQ generation and calibration • Single-rank • On-board I2 serial presence-detect (SPD) EEPROM • 16 internal banks; 4 groups of 4 banks each • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) • Selectable BC4 or BL8 on-the-fly (OTF) • Fly-by topology • Terminated control command and address bus • PCB: Height 1.23” (31.25mm) • RoHS Compliant and Halogen-Free
• Power Supply: VDD = 1.2V Typical • VDDQ = 1.2V Typical • VPP = 2.5V Typical • VDDSPD = 2.2V to 3.6V • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals • Low-power auto self refresh (LPASR) • Data bus inversion (DBI) for data bus • On-die VREFDQ generation and calibration • Single-rank • On-board I2 serial presence-detect (SPD) EEPROM • 8 internal banks; 2 groups of 4 banks each • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) • Selectable BC4 or BL8 on-the-fly (OTF) • Fly-by topology • Terminated control command and address bus • PCB: Height 1.23” (31.25mm) • RoHS Compliant and Halogen-Free
- Incredible PCIe Gen 4x4 NVMe performance
- Low-profile graphene aluminium heat spreader
- Slim M.2 2280 form factor
- High capacities of up to 4TB2
- PS5™ ready
- PCIe 4.0 NVMe high-performance
- Upgrade with full capacities up to 4096GB2
- Compact M.2 2280 form factor
- Low profile graphene aluminum heat spreader
• Power Supply: VDD = 1.2V Typical • VDDQ = 1.2V Typical • VPP = 2.5V Typical • VDDSPD = 2.2V to 3.6V • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals • Low-power auto self refresh (LPASR) • Data bus inversion (DBI) for data bus • On-die VREFDQ generation and calibration • Single-rank • On-board I2 serial presence-detect (SPD) EEPROM • 16 internal banks; 4 groups of 4 banks each • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) • Selectable BC4 or BL8 on-the-fly (OTF) • Fly-by topology • Terminated control command and address bus • PCB: Height 1.23” (31.25mm) • RoHS Compliant and Halogen-Free
• Power Supply: VDD = 1.1V Typical • VDDQ = 1.1V Typical • VPP = 1.8V Typical • VDDSPD = 1.8V to 2.0V • On-Die ECC • PCB: Height 1.18” (30.00mm) • RoHS Compliant and Halogen-Free
• Power Supply: VDD = 1.2V Typical • VDDQ = 1.2V Typical • VPP = 2.5V Typical • VDDSPD = 2.2V to 3.6V • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals • Low-power auto self refresh (LPASR) • Data bus inversion (DBI) for data bus • On-die VREFDQ generation and calibration • Single-rank • On-board I2 serial presence-detect (SPD) EEPROM • 16 internal banks; 4 groups of 4 banks each • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) • Selectable BC4 or BL8 on-the-fly (OTF) • Fly-by topology • Terminated control command and address bus • PCB: Height 1.18” (30.00mm) • RoHS Compliant and Halogen-Free
- Mighty DDR5 SODIMM performance
- Plug N Play automatic overclocking functionality1
- Intel® XMP 3.0 Certified
- Lower power consumption, increased efficiency
- Improved stability with on-die ECC
- Mighty DDR5 SODIMM performance
- Plug N Play automatic overclocking functionality1
- Intel® XMP 3.0 Certified
- Lower power consumption, increased efficiency
- Improved stability with on-die ECC
- Remarkable performance
- Features the latest 3D TLC NAND technology
- Supports a full security suite (TCG Opal, AES 256-bit, eDrive)
- Available in range of full capacities
- Powerful SODIMM performance
- Plug N Play automatic overclocking functionality1
- Intel® XMP-ready and XMP Certified
- Ready for AMD Ryzen™
- Higher performance with low power consumption
- Slim form factor, sleek design
- Powerful SODIMM performance
- Plug N Play automatic overclocking functionality1
- Intel® XMP-ready and XMP Certified
- Ready for AMD Ryzen™
- Higher performance with low power consumption
- Slim form factor, sleek design
- Powerful SODIMM performance
- Plug N Play automatic overclocking functionality1
- Intel® XMP-ready and XMP Certified
- Ready for AMD Ryzen™
- Higher performance with low power consumption
- Slim form factor, sleek design
- Powerful SODIMM performance
- Plug N Play automatic overclocking functionality1
- Intel® XMP-ready and XMP Certified
- Ready for AMD Ryzen™
- Higher performance with low power consumption
- Slim form factor, sleek design
KVR26N19S8/8
ValueRAM's KVR26N19S8/8 is a 1G x 64-bit (8GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM), 1Rx8, memory module, based on eight 1G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers.
KVR26N19S6/4
ValueRAM's KVR26N19S6/4 is a 512M x 64-bit (4GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM), 1Rx16, memory module, based on four 512M x 16-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers.
- Fast start-up, loading and file transfers
- More reliable and durable than a hard drive
- Multiple capacities with space for applications or a hard drive replacement
- Faster speeds — Class 10 UHS-I speeds up to 100MB/s.
- Optimized for use with Android devices — improved performance when used with an Android smartphone or tablet.
- Multiple capacities — Up to 512GB1 to store all your memorable photos and videos.
- Durable — for your peace of mind, The card has been extensively tested and proven to be waterproof, temperature proof, shock and vibration proof and X-Ray proof.
- Fast satrtup, loading and file transfers
- More reliable and durable than a hard drive
- Multiple capacities with space for applications or a hard drive replacement
- Powerful SODIMM performance
- Plug N Play automatic overclocking functionality1
- Intel® XMP-ready and XMP Certified
- Ready for AMD Ryzen™
- Higher performance with low power consumption
- Slim form factor, sleek design
- Mighty DDR5 SODIMM performance
- Plug N Play automatic overclocking functionality1
- Intel® XMP 3.0 Certified
- Lower power consumption, increased efficiency
- Improved stability with on-die ECC
- Fast start-up, loading and file transfers
- More reliable and durable than a hard drive
- Multiple capacities with space for applications or a hard drive replacement
- Fast start-up, loading and file transfers
- More reliable and durable than a hard drive
- Multiple capacities with space for applications or a hard drive replacement
- Fast start-up, loading and file transfers
- More reliable and durable than a hard drive
- Multiple capacities with space for applications or a hard drive replacement
- Power Supply: VDD=1.2V Typical
- VDDQ = 1.2V Typical
- VPP - 2.5V Typical
- VDDSPD=2.2V to 3.6V
- Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
- Low-power auto self refresh (LPASR)
- Data bus inversion (DBI) for data bus
- On-die VREFDQ generation and calibration
- Dual-rank
- On-board I2 serial presence-detect (SPD) EEPROM
- 16 internal banks; 4 groups of 4 banks each
- Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
- Selectable BC4 or BL8 on-the-fly (OTF)
- Fly-by topology
- Terminated control command and address bus
- PCB: Height 1.18” (30.00mm)
- RoHS Compliant and Halogen-Free
- Power Supply: VDD=1.2V Typical
- VDDQ = 1.2V Typical
- VPP - 2.5V Typical
- VDDSPD=2.2V to 3.6V
- Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
- Low-power auto self refresh (LPASR)
- Data bus inversion (DBI) for data bus
- On-die VREFDQ generation and calibration
- Single-rank
- On-board I2 serial presence-detect (SPD) EEPROM
- 16 internal banks; 4 groups of 4 banks each
- Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
- Selectable BC4 or BL8 on-the-fly (OTF)
- Fly-by topology
- Terminated control command and address bus
- PCB: Height 1.18” (30.00mm)
- RoHS Compliant and Halogen-Free
- DUAL INTERFACE ACCOMMODATES USB TYPE-A AND USB TYPE-C PORTS
- ADDITIONAL STORAGE FOR NEWER DEVICES WITH LIMITED EXPANSION PORTS
- FAST DATA TRANSFER SPEEDS UP TO 100MB/s READ AND 15MB/s WRITE
- DUAL INTERFACE ACCOMMODATES USB TYPE-A AND USB TYPE-C PORTS
- ADDITIONAL STORAGE FOR NEWER DEVICES WITH LIMITED EXPANSION PORTS
- FAST DATA TRANSFER SPEEDS UP TO 100MB/s READ AND 15MB/s WRITE
- DUAL INTERFACE ACCOMMODATES USB TYPE-A AND USB TYPE-C PORTS
- ADDITIONAL STORAGE FOR NEWER DEVICES WITH LIMITED EXPANSION PORTS
- FAST DATA TRANSFER SPEEDS UP TO 100MB/s READ AND 15MB/s WRITE
- EXPANDED STORAGE FOR TABLETS AND SMARTPHONES WITH USB OTG SUPPORT
- QUICKLY TRANSFER AND BACK UP FILES, PHOTOS AND VIDEO TO YOUR COMPUTER AT USB3.0 SPEEDS
- EASILY SHARE FILES BETWEEN MOBILE DEVICES WITHOUT THE NEED FOR CABLES OR WI-FI
- SMALL FROM FACTOR FOR EASY PORTABILITY
- EXPANDED STORAGE FOR TABLETS AND SMARTPHONES WITH USB OTG SUPPORT
- QUICKLY TRANSFER AND BACK UP FILES, PHOTOS AND VIDEO TO YOUR COMPUTER AT USB3.0 SPEEDS
- EASILY SHARE FILES BETWEEN MOBILE DEVICES WITHOUT THE NEED FOR CABLES OR WI-FI
- SMALL FROM FACTOR FOR EASY PORTABILITY
- EXPANDED STORAGE FOR TABLETS AND SMARTPHONES WITH USB OTG SUPPORT
- QUICKLY TRANSFER AND BACK UP FILES, PHOTOS AND VIDEO TO YOUR COMPUTER AT USB3.0 SPEEDS
- EASILY SHARE FILES BETWEEN MOBILE DEVICES WITHOUT THE NEED FOR CABLES OR WI-FI
- SMALL FROM FACTOR FOR EASY PORTABILITY
- ULTRA-SMALL, CAPLESS DESIGN WITH METAL CASING
- USB 3.1 GEN 1 (USB3.0)
- ULTRA-SMALL, CAPLESS DESIGN WITH METAL CASING
- USB 3.1 GEN 1 (USB3.0)
- Ultra-small, capless design with metal casing
- USB 3.2 Gen 11
- 100MB/s read
- Part Number: DTMC3/32GB
- Fast start-up, loading and file transfers
- More reliable and durable than a hard drive
- Multiple capacities with space for applications or a hard drive replacement