• Incredible PCIe Gen 4x4 NVMe performance
• Low-profile graphene aluminium heat spreader
• Slim M.2 2280 form factor
• High capacities of up to 4TB²
• PS5™ ready

• Limited Year of the Rabbit Zodiac 64GB Pendrive
• Metal USB drive with styling rubber casing
• Cynlinder acrylic display package

• Powerful SODIMM performance
• Plug N Play automatic overclocking functionality¹
• Intel® XMP-ready and XMP Certified
• Ready for AMD Ryzen™
• Higher performance with low power consumption
• Slim form factor, sleek design

• Gen 4x4 NVMe PCIe performance
• Perfect for thin laptops and small-form-factor PCs
•  Up to 3,000MB/s read, 1,300MB/s write
• Up to 3,000MB/s read, 1,300MB/s write

• Faster speeds — Class 10 UHS-I speeds up to 100MB/s.
• Optimized for use with Android devices — improved performance when used with an Android smartphone or tablet.
• Multiple capacities — Up to 512GB1 to store all your memorable photos and videos.
• Durable — for your peace of mind, The card has been extensively tested and proven to be waterproof, temperature proof, shock and vibration proof and X-Ray proof. 

• Cost-efficient, high-performance DDR4 upgrade
• Speeds up to 3,733MHz and kit capacity up to 128GB
• Intel® XMP-ready and XMP Certified
• Ready for AMD Ryzen™
• Low-profile heat spreader design
• Plug N Play functionality at 2666MHz¹

• Cost-efficient, high-performance DDR4 upgrade
• Speeds up to 3,733MHz and kit capacity up to 128GB
• Intel® XMP-ready and XMP Certified
• Ready for AMD Ryzen™
• Low-profile heat spreader design
• Plug N Play functionality at 2666MHz¹

• Power Supply: VDD = 1.2V Typical • VDDQ = 1.2V Typical • VPP = 2.5V Typical • VDDSPD = 2.2V to 3.6V • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals • Low-power auto self refresh (LPASR) • Data bus inversion (DBI) for data bus • On-die VREFDQ generation and calibration • Single-rank • On-board I2 serial presence-detect (SPD) EEPROM • 16 internal banks; 4 groups of 4 banks each • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) • Selectable BC4 or BL8 on-the-fly (OTF) • Fly-by topology • Terminated control command and address bus • PCB: Height 1.23” (31.25mm) • RoHS Compliant and Halogen-Free

• Power Supply: VDD = 1.2V Typical • VDDQ = 1.2V Typical • VPP = 2.5V Typical • VDDSPD = 2.2V to 3.6V • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals • Low-power auto self refresh (LPASR) • Data bus inversion (DBI) for data bus • On-die VREFDQ generation and calibration • Single-rank • On-board I2 serial presence-detect (SPD) EEPROM • 8 internal banks; 2 groups of 4 banks each • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) • Selectable BC4 or BL8 on-the-fly (OTF) • Fly-by topology • Terminated control command and address bus • PCB: Height 1.23” (31.25mm) • RoHS Compliant and Halogen-Free

• Greater performance starting at 4800MT/s
• Improved stability for overclocking
• Increased efficiency
• Intel® XMP 3.0 Certified
• AMD EXPO™ Certified
• Qualified by the world’s leading motherboard manufacturers¹
• Plug N Play at 4800MT/s{Footnote.N64683}}
• Low-profile heat spreader design

• Incredible PCIe Gen 4x4 NVMe performance
• Low-profile graphene aluminium heat spreader
• Slim M.2 2280 form factor
• High capacities of up to 4TB²
• PS5™ ready

• PCIe 4.0 NVMe high-performance
• Upgrade with full capacities up to 4096GB²
• Compact M.2 2280 form factor
• Low profile graphene aluminum heat spreader

• Power Supply: VDD = 1.2V Typical • VDDQ = 1.2V Typical • VPP = 2.5V Typical • VDDSPD = 2.2V to 3.6V • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals • Low-power auto self refresh (LPASR) • Data bus inversion (DBI) for data bus • On-die VREFDQ generation and calibration • Single-rank • On-board I2 serial presence-detect (SPD) EEPROM • 16 internal banks; 4 groups of 4 banks each • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) • Selectable BC4 or BL8 on-the-fly (OTF) • Fly-by topology • Terminated control command and address bus • PCB: Height 1.23” (31.25mm) • RoHS Compliant and Halogen-Free

• Power Supply: VDD = 1.1V Typical • VDDQ = 1.1V Typical • VPP = 1.8V Typical • VDDSPD = 1.8V to 2.0V • On-Die ECC • PCB: Height 1.18” (30.00mm) • RoHS Compliant and Halogen-Free

• Power Supply: VDD = 1.2V Typical • VDDQ = 1.2V Typical • VPP = 2.5V Typical • VDDSPD = 2.2V to 3.6V • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals • Low-power auto self refresh (LPASR) • Data bus inversion (DBI) for data bus • On-die VREFDQ generation and calibration • Single-rank • On-board I2 serial presence-detect (SPD) EEPROM • 16 internal banks; 4 groups of 4 banks each • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) • Selectable BC4 or BL8 on-the-fly (OTF) • Fly-by topology • Terminated control command and address bus • PCB: Height 1.18” (30.00mm) • RoHS Compliant and Halogen-Free

• Mighty DDR5 SODIMM performance
• Plug N Play automatic overclocking functionality¹
• Intel® XMP 3.0 Certified
• Lower power consumption, increased efficiency
• Improved stability with on-die ECC

• Mighty DDR5 SODIMM performance
• Plug N Play automatic overclocking functionality¹
• Intel® XMP 3.0 Certified
• Lower power consumption, increased efficiency
• Improved stability with on-die ECC

• Remarkable performance
• Features the latest 3D TLC NAND technology
• Supports a full security suite (TCG Opal, AES 256-bit, eDrive)
• Available in range of full capacities

• Powerful SODIMM performance
• Plug N Play automatic overclocking functionality¹
• Intel® XMP-ready and XMP Certified
• Ready for AMD Ryzen™
• Higher performance with low power consumption
• Slim form factor, sleek design

• Powerful SODIMM performance
• Plug N Play automatic overclocking functionality¹
• Intel® XMP-ready and XMP Certified
• Ready for AMD Ryzen™
• Higher performance with low power consumption
• Slim form factor, sleek design

• Powerful SODIMM performance
• Plug N Play automatic overclocking functionality¹
• Intel® XMP-ready and XMP Certified
• Ready for AMD Ryzen™
• Higher performance with low power consumption
• Slim form factor, sleek design

• Powerful SODIMM performance
• Plug N Play automatic overclocking functionality¹
• Intel® XMP-ready and XMP Certified
• Ready for AMD Ryzen™
• Higher performance with low power consumption
• Slim form factor, sleek design

KVR26N19S8/8
ValueRAM's KVR26N19S8/8 is a 1G x 64-bit (8GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM), 1Rx8, memory module, based on eight 1G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers.

KVR26N19S6/4
ValueRAM's KVR26N19S6/4 is a 512M x 64-bit (4GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM), 1Rx16, memory module, based on four 512M x 16-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers.

• Fast satrtup, loading and file transfers
• More reliable and durable than a hard drive
• Multiple capacities with space for applications or a hard drive replacement

• Powerful SODIMM performance
• Plug N Play automatic overclocking functionality¹
• Intel® XMP-ready and XMP Certified
• Ready for AMD Ryzen™
• Higher performance with low power consumption
• Slim form factor, sleek design

• Mighty DDR5 SODIMM performance
• Plug N Play automatic overclocking functionality¹
• Intel® XMP 3.0 Certified
• Lower power consumption, increased efficiency
• Improved stability with on-die ECC

• Fast start-up, loading and file transfers
• More reliable and durable than a hard drive
• Multiple capacities with space for applications or a hard drive replacement

• Fast start-up, loading and file transfers
• More reliable and durable than a hard drive
• Multiple capacities with space for applications or a hard drive replacement

• Fast start-up, loading and file transfers
• More reliable and durable than a hard drive
• Multiple capacities with space for applications or a hard drive replacement

•  Power Supply: VDD=1.2V Typical
• VDDQ = 1.2V Typical
• VPP - 2.5V Typical
• VDDSPD=2.2V to 3.6V
• Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die VREFDQ generation and calibration
• Dual-rank
• On-board I2 serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Fly-by topology
• Terminated control command and address bus
• PCB: Height 1.18” (30.00mm)
• RoHS Compliant and Halogen-Free

• Power Supply: VDD=1.2V Typical
• VDDQ = 1.2V Typical
• VPP - 2.5V Typical
• VDDSPD=2.2V to 3.6V
• Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die VREFDQ generation and calibration
• Single-rank
• On-board I2 serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Fly-by topology
• Terminated control command and address bus
• PCB: Height 1.18” (30.00mm)
• RoHS Compliant and Halogen-Free

• DUAL INTERFACE ACCOMMODATES USB TYPE-A AND USB TYPE-C PORTS
• ADDITIONAL STORAGE FOR NEWER DEVICES WITH LIMITED EXPANSION PORTS
• FAST DATA TRANSFER SPEEDS UP TO 100MB/s READ AND 15MB/s WRITE

• DUAL INTERFACE ACCOMMODATES USB TYPE-A AND USB TYPE-C PORTS
• ADDITIONAL STORAGE FOR NEWER DEVICES WITH LIMITED EXPANSION PORTS
• FAST DATA TRANSFER SPEEDS UP TO 100MB/s READ AND 15MB/s WRITE

• DUAL INTERFACE ACCOMMODATES USB TYPE-A AND USB TYPE-C PORTS
• ADDITIONAL STORAGE FOR NEWER DEVICES WITH LIMITED EXPANSION PORTS
• FAST DATA TRANSFER SPEEDS UP TO 100MB/s READ AND 15MB/s WRITE

• Fast start-up, loading and file transfers
• More reliable and durable than a hard drive
• Multiple capacities with space for applications or a hard drive replacement