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Laptop RAM
Laptop RAM
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  • CAS Latency: CL19
  • Rank: 1Rx8
  • Voltage: 1.2V
  • PCB Height: 1.18 inches
  • Pin: 260 Pin
  • Lifetime Limited Warranty
RM89.00
  • CAS Latency: CL19
  • Rank: 1Rx8
  • Voltage: 1.2V
  • PCB Height: 1.18 inches
  • Pin: 260 Pin
  • Lifetime Limited Warranty
RM89.00
  •  Power Supply: VDD=1.2V Typical
  • VDDQ = 1.2V Typical
  • VPP - 2.5V Typical
  • VDDSPD=2.2V to 3.6V
  • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
  • Low-power auto self refresh (LPASR)
  • Data bus inversion (DBI) for data bus
  • On-die VREFDQ generation and calibration
  • Dual-rank
  • On-board I2 serial presence-detect (SPD) EEPROM
  • 16 internal banks; 4 groups of 4 banks each
  • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
  • Selectable BC4 or BL8 on-the-fly (OTF)
  • Fly-by topology
  • Terminated control command and address bus
  • PCB: Height 1.18” (30.00mm)
  • RoHS Compliant and Halogen-Free
RM258.00
  • Power Supply: VDD=1.2V Typical
  • VDDQ = 1.2V Typical
  • VPP - 2.5V Typical
  • VDDSPD=2.2V to 3.6V
  • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
  • Low-power auto self refresh (LPASR)
  • Data bus inversion (DBI) for data bus
  • On-die VREFDQ generation and calibration
  • Single-rank
  • On-board I2 serial presence-detect (SPD) EEPROM
  • 16 internal banks; 4 groups of 4 banks each
  • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
  • Selectable BC4 or BL8 on-the-fly (OTF)
  • Fly-by topology
  • Terminated control command and address bus
  • PCB: Height 1.18” (30.00mm)
  • RoHS Compliant and Halogen-Free
RM134.00